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Top Posts
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- RTOS pioneer Jim Ready discusses the intersection between embedded design and EDA
- EMA Design Automation announces FootprintGen—an app for Cadence Allegro and OrCAD PCB design tools that cuts the time needed to design PCB footprint models for new components
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Tag Archives: Toshiba
Hot Chips 24 in August will feature a 3D tutorial plus details of new chips from AMD, Intel, Xilinx, and more
This year’s Hot Chips conference takes place on August 24-29 in a new venue: The Flint Center for the Performing Arts in Cupertino, CA. On the afternoon of August 27, there’s a die-stacking tutorial with presentations from AMD, Amkor, SK … Continue reading
Posted in EDA360
Tagged Advanced Micro Devices, AMD, Field-programmable gate array, Hot Chips, Intel, Toshiba, Xilinx
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Toshiba, SanDisk break 20nm barrier with 19nm NAND Flash
Memories now drive process technology and NAND Flash is the current main driver. So it’s no surprise that NAND Flash memories are the first to be produced at a process node below 20nm, which is precisely what Toshiba and SanDisk … Continue reading
