Tag Archives: Toshiba

Hot Chips 24 in August will feature a 3D tutorial plus details of new chips from AMD, Intel, Xilinx, and more

This year’s Hot Chips conference takes place on August 24-29 in a new venue: The Flint Center for the Performing Arts in Cupertino, CA. On the afternoon of August 27, there’s a die-stacking tutorial with presentations from AMD, Amkor, SK … Continue reading

Posted in EDA360 | Tagged , , , , , , | Leave a comment

Toshiba, SanDisk break 20nm barrier with 19nm NAND Flash

Memories now drive process technology and NAND Flash is the current main driver. So it’s no surprise that NAND Flash memories are the first to be produced at a process node below 20nm, which is precisely what Toshiba and SanDisk … Continue reading

Posted in EDA360, Silicon Realization | Tagged , , , , | Leave a comment