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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- ARM furthers its “cover the earth” strategy with introduction of R5 and R7 core variants for fast, real-time, deterministic SoC applications
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- Realizing the ARM Cortex-A15: What does the road to 2.5GHz look like?
- ARM adds ARM Cortex-A15 and Cortex-R5 models to Fast Models 6.1 release, making these cores immediately available to System Realization teams
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
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Tag Archives: Wide I/O SDRAM
3D Thursday: The low down on low-power CPU-memory connections from EDPS
Earlier this month at EDPS, Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, said that Wide I/O SDRAM memory was going to drive the earliest adoption of 3D IC assembly techniques. Not simply because Wide I/O … Continue reading
Posted in 2.5D, 3D, EDA360, Memory, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged SDRAM, SerDes, Wide I/O SDRAM
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3D Thursday: Is Wide I/O SDRAM free for the end user???
A recent email from Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, suggested that Wide I/O used in a 3D stack is free for the end user. In other words, there’s no incremental cost in the … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged 3D, SDRAM, TSV, Wide I/O, Wide I/O SDRAM
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