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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- My workbench from 1978 highlighted in EETimes as one of engineering’s messiest desks
- Friday Video (Musical Bonus): What does it take to play the Dr. Who theme song with a pair of Tesla coils, a Faraday cage, and two unlucky audience members?
- Asymmetric, dual-core NXP LPC4300 microcontrollers split tasks between ARM Cortex-M4 and -M0 cores, cost $3.75 and up
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- 3D Thursday: Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (UPDATED!)
- Want a peek at a possible Qualcomm 3D IC roadmap?
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Tag Archives: Wide I/O SDRAM
3D Thursday: The low down on low-power CPU-memory connections from EDPS
Earlier this month at EDPS, Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, said that Wide I/O SDRAM memory was going to drive the earliest adoption of 3D IC assembly techniques. Not simply because Wide I/O … Continue reading
Posted in 2.5D, 3D, EDA360, Memory, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged SDRAM, SerDes, Wide I/O SDRAM
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3D Thursday: Is Wide I/O SDRAM free for the end user???
A recent email from Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, suggested that Wide I/O used in a 3D stack is free for the end user. In other words, there’s no incremental cost in the … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged 3D, SDRAM, TSV, Wide I/O, Wide I/O SDRAM
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