Tag Archives: Wide I/O SDRAM

3D Thursday: The low down on low-power CPU-memory connections from EDPS

Posted on April 18, 2012 by

Earlier this month at EDPS, Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, said that Wide I/O SDRAM memory was going to drive the earliest adoption of 3D IC assembly techniques. Not simply because Wide I/O … Continue reading →

Posted in 2.5D, 3D, EDA360, Memory, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O | Tagged , , | Leave a comment

3D Thursday: Is Wide I/O SDRAM free for the end user???

Posted on February 16, 2012 by

A recent email from Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, suggested that Wide I/O used in a 3D stack is free for the end user. In other words, there’s no incremental cost in the … Continue reading →

Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O | Tagged , , , , | Leave a comment