Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- After Silicon, SoC, and System Realization comes Dynasty Realization
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology
- Friday Video: How many hardware/software integration lessons can you absorb in 34 minutes?
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Is the Common Platform Alliance a credible competitor to TSMC?
Download the EDA360 Vision Paper here:
Tag Archives: Xbox 360
What else can you do with IBM’s 45nm SOI process? More games, the Cell processor, and photonics
Last week, I wrote about IBM’s 45nm SOI process, which is now used in a variety of interesting applications such as the Jeopardy!-playing IBM Watson supercomputer, the soon-to-be-available Nintendo Wii U, and an experimental IBM brain simulator. I wondered what … Continue reading
Posted in EDA360, Silicon Realization
Tagged Cell, IBM, Nintendo Wii, Silicon on insulator, Xbox 360
1 Comment
Friday Video: Star Wars Edition of Microsoft Xbox 360 proves plastic part of System Realization
Coming this holiday season is the Star Wars edition of the Microsoft Xbox 360. The game unit is styled to resemble the droid R2D2 and the hand controller is plated in gold and silver to remind you of C3P0. Other … Continue reading
Posted in EDA360, System Realization, Uncategorized
Tagged C-3PO, Kinect, Lucasfilm, Microsoft, R2-D2, Xbox, Xbox 360
Leave a comment
EDA360 Insider 