Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- After Silicon, SoC, and System Realization comes Dynasty Realization
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology
- Friday Video: How many hardware/software integration lessons can you absorb in 34 minutes?
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Is the Common Platform Alliance a credible competitor to TSMC?
Download the EDA360 Vision Paper here:
Tag Archives: zynq 7000
Xilinx takes Zynq to 11—or more precisely to 1GHz
In the satirical 1984 movie “This is Spinal Tap,” Nigel the guitarist explains why the volume controls on his Marshall amps go to 11 instead of 10 like everyone else’s amps: “If we need that extra push over the cliff,” … Continue reading
Posted in Cortex-A9, EDA360
Tagged ARM Cortex-A9, ARM Cortex-A9 MPCore, FPGA, Xilinx, zynq 7000
Leave a comment
Friday Video: Two of this week’s EETimes ACE Award Winners related to each other: Xilinx Zynq and Cadence Virtual System Platform
This week at Design West in San Jose—the conference formerly known as the Embedded Systems Conference—EETimes gave out ACE awards to the year’s outstanding companies, people, and products. Two of the ACE winners have something in common. The first winner, … Continue reading
Posted in EDA360, SoC Realization, System Realization
Tagged Cadence, EPP, virtual prototype, Xilinx, Zynq, zynq 7000
Leave a comment
EDA360 Insider 