3D Thursday: 3D-IC Design Tools and Services Tour Guide is just in time for DAC. You can download a copy now.

The GSA has just issued a 3D-IC tools and services guide in time for DAC. This 62-page guide provides eight pages of background info on the state of 3D assembly technology based on public information like that provided by Xilinx on the 2.5D technology in its newest 28nm FPGAs. (See “Need really big FPGAs? Xilinx will be taking the “3D” route for initial Virtex 7 parts”) The guide also provides information from 15 EDA tool vendors with 3D design offerings and four R&D centers working on 3D research. It also lists one 3D “value chain producer” (eSilicon). The guide was assembled under the leadership of Herb Reiter, who spearheads GSA’s work on 3D. You can download the GSA’s guide to 3D here.

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 3D, EDA360, Silicon Realization, SoC Realization, System Realization and tagged , , , , , . Bookmark the permalink.

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