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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 3D IC
- ARM architecture
- ARM Cortex-A15
- Dave Jones
- Double Patterning
- Field-programmable gate array
- Flash memory
- Freescale Semiconductor
- Jim Hogan
- Low Power
- Mixed Signal
- Multi-core processor
- Printed circuit board
- Texas Instruments
- Wide I/O
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- 10 ways to get your EDA tools to run faster, smoother, and longer
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- Friday Video: Ready for a little mobile phone teardown archaeology? Dave Jones compares state of the art in 1994 (Motorola) with an evolved 2000 (Nokia)
- 20nm design: What have we learned so far?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
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Tag Archives: GlobalFoundries
Where do semiconductor foundries come from?
Have you ever wondered how we got from a world solely occupied by semiconductor vendors with their own fabs to today’s hodgepodge of IDMs (independent device manufacturers, the new name for the old-style “semiconductor vendor”), fab-lite vendors, and fables vendors? … Continue reading
Posted in EDA360, Silicon Realization Tagged GlobalFoundries, Semiconductor, TSMC Leave a comment
Friday Video: Luigi Capodieci, a fellow at GLOBALFOUNDRIES, talks 20nm and below, EUV, FINFETs, and the state of the foundry business
Be sure to watch this excellent 13-minute interview done by Mark LePedus starring Luigi Capodieci, a fellow with GLOBALFOUNDRIES, to get a close-up-and-personal look at the state of the foundry business (it’s not dying), 20nm design, EUV in the wings, … Continue reading
Posted in 14nm, 20nm, EUV, Globalfoundries, Silicon Realization Tagged Extreme ultraviolet, FinFET, GlobalFoundries Leave a comment
3D Thursday: Some unexpected implications of IP subsystems coupled with 3D IC assembly
A new “Experts at the Table” conversation on the Semiconductor Manufacturing and Design Community (SMD) site about IP Subsystems among Kevin Meyer, vice president of design enablement strategy and alliances at GlobalFoundries; Steve Roddy, vice president of marketing at Tensilica; … Continue reading
Posted in 3D, EDA360 Tagged 3D IC, Atrenta, GlobalFoundries, IP Subsystems, Tensilica Leave a comment
Beyond breakfast: An ethical bribe for attending “The Path to Yielding at 2(x)nm and Beyond” at DAC
Yesterday, I wrote about a terrific discussion panel about the challenges of 20nm design at DAC. I am moderating the panel and there will be speakers from the Common Platform partners including IBM, Samsung, GLOBALFOUNDRIES (just confirmed!), and Cadence. (See … Continue reading
Posted in 20nm, DAC, EDA360, Silicon Realization Tagged 20nm, Cadence, Common Platform, GlobalFoundries, IBM, Samsung Leave a comment
3D Thursday: GLOBALFOUNDRIES adds TSV capability for 28nm and 20nm die to Fab 8 in Saratoga County, New York
Customers’ clamor for 3D IC assembly capability and die with TSVs (through-silicon vias) has apparently gotten loud enough to cause a change of game plan for GLOBALFOUNDRIES, which announced today that it is spending “tens of millions of dollars” to … Continue reading
You have six weeks to wait for the Semico IP Summit. What will you do until then?
Use of IP in the design of SoCs has long been a fact. The very name “SoC” says that you’re using microprocessor IP at the very least. With that comes memory IP, memory controller IP, interface IP, analog IP, etc. … Continue reading
Posted in EDA360, IP, SoC Realization Tagged Advanced Micro Devices, Cadence, GlobalFoundries, Mentor Graphics, SoC, Synopsys, TSMC Leave a comment
Common Platform: Why do these companies (IBM, Samsung, GLOBALFOUNDRIES) collaborate?
Ana Hunter, Foundry Services VP at Samsung Semiconductor, had the honor of kicking off the Global Technology Forum in Silicon Valley. She decided to devote her short intro speech to answering the basic question about the Common Platform—a partnership among … Continue reading
Posted in EDA360, Globalfoundries, Samsung, Silicon Realization Tagged Common Platform, Global Technology Forum, GlobalFoundries, IBM, Samsung Leave a comment
By the numbers: 20nm (and 40nm, 32nm, 28nm, and 14nm) design to be discussed in technical detail at next week’s CDNLive! conference in Silicon Valley
There’s still time to register for CDNLive!, which is being held on March 13 and 14 at the Doubletree Hotel in San Jose, California so let me give you a few numbers to whet your appetite: 40nm, 32nm, 28nm, 20nm, … Continue reading
Posted in 14nm, 20nm, 28nm, 32nm, 40nm, CDNLive!, EDA360, Silicon Realization, SoC, SoC Realization, System Realization Tagged 14nm, 20nm, 28nm, 32nm, 40nm, CDNLive!, Double Patterning, Doubletree, GlobalFoundries, IBM, Samsung Leave a comment
Friday Video: Common Platform Technology Forum reveals program agenda, rolls into Silicon Valley on March 14
The Common Platform partners are IBM, Samsung, and GLOBALFOUNDRIES and their annual Technology Forum rolls into Silicon Valley on March 14, so you have a couple of weeks to sign up. This short video from ChipEstimate.com gives you a good … Continue reading
Posted in 14nm, 20nm, 28nm Tagged 14nm, 20nm, 28nm, Common Platform, GlobalFoundries, IBM, Samsung Leave a comment
3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work
I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading
IBM to manufacture 32nm SOI chips with eDRAM in new GLOBALFOUNDRIES Fab 8 (Malta, NY)
IBM is the first announced customer for GLOBALFOUNDRIES’ Fab 8 in Malta, NY. The companies plan to manufacture IBM’s 32nm SOI devices at the site using an SOI process technology. The new plant has already been facilitized with more than … Continue reading
Posted in 32nm, EDA360, Silicon Realization Tagged 32nm, eDRAM, GlobalFoundries, IBM, SOI Leave a comment
Collaboration is key to making DFM work at 28nm and below
At the final presentation I attended at last week’s Global Technology Forum, Manoj Chacko from Cadence discussed how to get “everything you’re entitled to” with In-Design DFM (Design for Manufacturing). Two of the key yield detractors Chacko discussed are yield … Continue reading
Posted in EDA360, Globalfoundries, Silicon Realization, SoC Realization Tagged GlobalFoundries Leave a comment
3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises
Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading
Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV Tagged Amkor, Fujitsu, GlobalFoundries, Imec, Intel, Micron, Panasonic, Qualcomm, Samsung, Sony, TSMC 1 Comment
Globalfoundries, LSI Corp, and Broadcom help Editorial Director Ed Sperling give the industry a low-power report card. How did we score?
On Wednesday at DAC’s show-floor Pavilion, Low-Power Engineering’s Editorial Director Ed Sperling chaired a panel with the intent of giving the industry a report card on its low-power engineering efforts. Along with Sperling on the Pavilion platform were Andrew Brotman, … Continue reading
Posted in DAC, EDA360, Low Power, Silicon Realization, SoC Realization, System Realization Tagged Broadcom, GlobalFoundries, LSI Corp Leave a comment
Gartner’s Sam Wang tosses down the 28nm Silicon Realization gauntlet to IC design houses
Sam Wang may have been a Gartner analyst for only six months or so, but he’s already learned how to drop a stunner on the audience. The event was today’s Gartner Semiconductor briefing at the San Jose Doubletree Hotel near … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization Tagged 20nm, 28nm, Foundry, Gartner, GlobalFoundries, TSMC Leave a comment
3D Thursday: Six more firms join Sematech 3D initiative
EETimes’ Peter Clarke reports that six more companies have joined the Sematech 3D enablement program. The six new members are: Advanced Semiconductor Engineering Inc. (ASE) Altera Corp Analog Devices Inc. (ADI) LSI Corp On Semiconductor Corp Qualcomm Inc These six … Continue reading
Daniel Nenni’s 100th blog. (It’s about TSMC, no surprise)—Congratulations to Daniel
Strategic Foundry Relationship expert and industry blogger Daniel Nenni has just published the hundredth entry in his Silicon Valley Blog. The topic is TSMC’s recent conference and Nenni, who writes a lot about TSMC, dishes up some cogent analysis and … Continue reading
Posted in Uncategorized Tagged GlobalFoundries, TSMC Leave a comment
ARM’s Cortex-A15: A big step up for the ARM processor architecture. Targeting 32nm and 28nm technology nodes.
Earlier this week Cadence announced that it worked with ARM to develop an implementation methodology for the recently announced, high-end ARM Cortex-A15 processor core, code-named Eagle. The ARM Cortex-A15 processor core has an expanded 40-bit (1Tbyte) memory address space (called … Continue reading
Posted in Apps, ARM, EDA360, System Realization Tagged GlobalFoundries, IBM, Samsung, STMicroelectronics, TI 1 Comment