Tag Archives: 3D IC

3D Thursday: Some unexpected implications of IP subsystems coupled with 3D IC assembly

A new “Experts at the Table” conversation on the Semiconductor Manufacturing and Design Community (SMD) site about IP Subsystems among Kevin Meyer, vice president of design enablement strategy and alliances at GlobalFoundries; Steve Roddy, vice president of marketing at Tensilica; … Continue reading

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3D preview from EDPS: Qualcomm’s Director of Engineering Riko Radojcic talks 3D and 3D EDA

Last week’s Electronic Design Process Symposium (EDPS) opened a rich new vein of 3D IC material and you’ll see a lot nuggets from me on that topic in the next few days. Meanwhile, Richard Goering has already published a post … Continue reading

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3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program

ElectroIQ reports that CEA-Leti in Grenoble has just launched an Open 3D IC program to permit companies more open access to the 3D IC assembly technologies developed at the research center. Last December, CEA-Leti and ST-Ericsson made a joint presentation … Continue reading

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3D Thursday (OK, Friday): Live from Newport Beach—The IEEE 3D IC Workshop

I’m attending the all-day workshop on 3D ICs being held by the local IEEE Chapter of the CPMT (Components, Packaging, and Manufacturing Technology) Society and it’s a huge success with 150 attendees. I’m busy listening to presentations, but here’s a … Continue reading

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3D Thursday: A busy week coming up for 3D ICs

This is a very busy week for 3D in the world of the EDA360 Insider. I am about to board a plane for John Wayne Airport to attend an IEEE workshop on 3D IC assembly. Next Monday, there’s a meeting on … Continue reading

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3D Thursday: How do you get to 3D ICs? The EDA view

My second panelist to speak on last week’s 3D IC panel at the 9th International SoC Conference in Newport Beach was Samta Bonsal who manages Silicon Realization Strategic Marketing at Cadence Design Systems. Samta has two hats at Cadence. One … Continue reading

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3D Thursday: Where can you start with 3D?

My first panelist to speak on last week’s 3D IC panel at the 9th International SoC Conference in Newport Beach was Herb Reiter, generally known as “Mr. 3D.” Herb knows everyone in the industry connected to anything 3D. He’s been … Continue reading

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3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging

Last week at the 9th International SoC Conference in Newport Beach, I moderated a 3D IC panel that did a great job of exploring today’s state of the art for 3D IC development. I will be blogging the presentations made … Continue reading

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3D Thursday: Low-cost, all-day workshop on 3D IC to be held in Newport Beach, December 9. Early bird discount ends November 25

This has to be the 3D IC educational bargain for this year. The Orange County Chapter of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is sponsoring an all-day workshop on 3D IC technology on December 9, 2011. The … Continue reading

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