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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 3D IC 20nm 28nm 32nm 40nm Agilent Altera AMD Analog Android Apple ARM ARM architecture ARM Cortex-A15 ASIC Broadcom Cadence Canon Cortex Cortex-A15 Cortex-M0 DAC Dave Jones DDR3 DDR4 Double Patterning EDA EDPS Field-programmable gate array FinFET Flash Flash memory FPGA Freescale Freescale Semiconductor GlobalFoundries Google IBM Intel IP iPad iPhone JEDEC Jim Hogan Kinect Linux Low Power Lytro microcontroller Micron Microsoft Mixed Signal Multi-core processor Nvidia OrCAD pcb Printed circuit board Qualcomm Robot Samsung SDRAM Snapdragon SoC STMicroelectronics SystemC Texas Instruments TI TSMC USB verification video Wide I/O XilinxTop Posts
- Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Ambarella cuts power on HD camera controller SoC using Samsung 32nm process technology
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
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Tag Archives: TI
3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
Last week at the 9th International SoC Conference in Newport Beach, I moderated a 3D IC panel that did a great job of exploring today’s state of the art for 3D IC development. I will be blogging the presentations made … Continue reading
What’s unique about the new $199 Android-based Amazon Kindle Fire tablet?
Is it the toughened Gorilla-Glass screen? Nope. Is it the dual-core processor? Nope. Is it the “cloud-accelerated” Amazon Silk browser? Nope. Is it the 8-hour battery life? Certainly not. Is it the unified email inbox? Getting warmer. Is it the … Continue reading
Posted in Android, Ecosystem, EDA360, System Realization
Tagged Amazon, Kindle, Kindle Fire, OMAP, TI
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Need an ARM-based 32-bit microcontroller? There’s more than a few full houses on offer.
When 17 microcontroller vendors pick your processor architecture, you have a right to sing “Something’s happening here.” Alban Rampon of ARM just published a blog entry titled “ARM Cortex-M—How could you choose your microcontroller?” This blog entry lists 17 semiconductor … Continue reading
Mashup of the Titans: TI to buy National Semi
Good thing this wasn’t announced on April 1! The Wall Street Journal is reporting that TI intends to buy National Semiconductor for $6.5 billion, $25/share, essentially a 78% premium over today’s closing price for National’s stock. These two semiconductor firms … Continue reading
Friday video: OMAP 5 and the future of user interfaces. Are you ready for your closeup, Mr. Cruise?
Earlier this week, TI introduced its OMAP 5 quad-core platform for mobile multimedia devices. It has four on-chip ARM processor cores, two ARM Cortex-A15 application processors—capable of running at 2GHz each if needed—and two ARM Cortex-M4 cores to handle real-time … Continue reading
ARM’s Cortex-A15: A big step up for the ARM processor architecture. Targeting 32nm and 28nm technology nodes.
Earlier this week Cadence announced that it worked with ARM to develop an implementation methodology for the recently announced, high-end ARM Cortex-A15 processor core, code-named Eagle. The ARM Cortex-A15 processor core has an expanded 40-bit (1Tbyte) memory address space (called … Continue reading
Posted in Apps, ARM, EDA360, System Realization
Tagged GlobalFoundries, IBM, Samsung, STMicroelectronics, TI
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