Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- AppliedMicro demos FPGA emulation of multicore server chip based on new 64-bit ARMv8 architecture
- Semico reports that ASICS, ASSPs, SoCs, and core-based ICs comprise the fastest growing category in MOS logic chips
- FREE DAC 2012 Exhibit 3-day passes. Limited quantity. Time-limited offer. Get ‘em NOW!
- Want to see the future of low-power SoC design? Have a look into Gary Smith’s crystal ball.
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Common Platform: Why do these companies (IBM, Samsung, GLOBALFOUNDRIES) collaborate?
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- 3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
Download the EDA360 Vision Paper here:
Tag Archives: TI
3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
Last week at the 9th International SoC Conference in Newport Beach, I moderated a 3D IC panel that did a great job of exploring today’s state of the art for 3D IC development. I will be blogging the presentations made … Continue reading
What’s unique about the new $199 Android-based Amazon Kindle Fire tablet?
Is it the toughened Gorilla-Glass screen? Nope. Is it the dual-core processor? Nope. Is it the “cloud-accelerated” Amazon Silk browser? Nope. Is it the 8-hour battery life? Certainly not. Is it the unified email inbox? Getting warmer. Is it the … Continue reading
Posted in Android, Ecosystem, EDA360, System Realization
Tagged Amazon, Kindle, Kindle Fire, OMAP, TI
Leave a comment
Need an ARM-based 32-bit microcontroller? There’s more than a few full houses on offer.
When 17 microcontroller vendors pick your processor architecture, you have a right to sing “Something’s happening here.” Alban Rampon of ARM just published a blog entry titled “ARM Cortex-M—How could you choose your microcontroller?” This blog entry lists 17 semiconductor … Continue reading
Mashup of the Titans: TI to buy National Semi
Good thing this wasn’t announced on April 1! The Wall Street Journal is reporting that TI intends to buy National Semiconductor for $6.5 billion, $25/share, essentially a 78% premium over today’s closing price for National’s stock. These two semiconductor firms … Continue reading
Friday video: OMAP 5 and the future of user interfaces. Are you ready for your closeup, Mr. Cruise?
Earlier this week, TI introduced its OMAP 5 quad-core platform for mobile multimedia devices. It has four on-chip ARM processor cores, two ARM Cortex-A15 application processors—capable of running at 2GHz each if needed—and two ARM Cortex-M4 cores to handle real-time … Continue reading
ARM’s Cortex-A15: A big step up for the ARM processor architecture. Targeting 32nm and 28nm technology nodes.
Earlier this week Cadence announced that it worked with ARM to develop an implementation methodology for the recently announced, high-end ARM Cortex-A15 processor core, code-named Eagle. The ARM Cortex-A15 processor core has an expanded 40-bit (1Tbyte) memory address space (called … Continue reading
Posted in Apps, ARM, EDA360, System Realization
Tagged GlobalFoundries, IBM, Samsung, STMicroelectronics, TI
1 Comment
