Tag Archives: TI

3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging

Posted on November 9, 2011 by sleibson2

Last week at the 9th International SoC Conference in Newport Beach, I moderated a 3D IC panel that did a great job of exploring today’s state of the art for 3D IC development. I will be blogging the presentations made … Continue reading →

Posted in 28nm, 3D, EDA360, Low Power, Memory, TSV | Tagged , , , , , , , , , , , | 1 Comment

What’s unique about the new $199 Android-based Amazon Kindle Fire tablet?

Posted on September 28, 2011 by sleibson2

Is it the toughened Gorilla-Glass screen? Nope. Is it the dual-core processor? Nope. Is it the “cloud-accelerated” Amazon Silk browser? Nope. Is it the 8-hour battery life? Certainly not. Is it the unified email inbox? Getting warmer. Is it the … Continue reading →

Posted in Android, Ecosystem, EDA360, System Realization | Tagged , , , , | Leave a comment

Need an ARM-based 32-bit microcontroller? There’s more than a few full houses on offer.

Posted on August 3, 2011 by sleibson2

When 17 microcontroller vendors pick your processor architecture, you have a right to sing “Something’s happening here.” Alban Rampon of ARM just published a blog entry titled “ARM Cortex-M—How could you choose your microcontroller?” This blog entry lists 17 semiconductor … Continue reading →

Posted in ARM, EDA360 | Tagged , , , , , , , , , , | Leave a comment

Mashup of the Titans: TI to buy National Semi

Posted on April 4, 2011 by sleibson2

Good thing this wasn’t announced on April 1! The Wall Street Journal is reporting that TI intends to buy National Semiconductor for $6.5 billion, $25/share, essentially a 78% premium over today’s closing price for National’s stock. These two semiconductor firms … Continue reading →

Posted in EDA360 | Tagged , | Leave a comment

Friday video: OMAP 5 and the future of user interfaces. Are you ready for your closeup, Mr. Cruise?

Posted on February 11, 2011 by sleibson2

Earlier this week, TI introduced its OMAP 5 quad-core platform for mobile multimedia devices. It has four on-chip ARM processor cores, two ARM Cortex-A15 application processors—capable of running at 2GHz each if needed—and two ARM Cortex-M4 cores to handle real-time … Continue reading →

Posted in Apps, ARM, EDA360 | Tagged , | 1 Comment

ARM’s Cortex-A15: A big step up for the ARM processor architecture. Targeting 32nm and 28nm technology nodes.

Posted on September 28, 2010 by sleibson2

Earlier this week Cadence announced that it worked with ARM to develop an implementation methodology for the recently announced, high-end ARM Cortex-A15 processor core, code-named Eagle. The ARM Cortex-A15 processor core has an expanded 40-bit (1Tbyte) memory address space (called … Continue reading →

Posted in Apps, ARM, EDA360, System Realization | Tagged , , , , | 1 Comment