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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
2.5D 3D 3D IC 20nm 28nm 32nm 40nm Agilent Altera AMD Analog Android Apple ARM ARM architecture ARM Cortex-A15 ASIC Broadcom Cadence Canon Cortex Cortex-A15 Cortex-M0 DAC Dave Jones DDR3 DDR4 Double Patterning EDA EDPS Field-programmable gate array FinFET Flash Flash memory FPGA Freescale Freescale Semiconductor GlobalFoundries Google IBM Intel IP iPad iPhone JEDEC Jim Hogan Kinect Linux Low Power Lytro microcontroller Micron Microsoft Mixed Signal Multi-core processor Nvidia OrCAD pcb Printed circuit board Qualcomm Robot Samsung SDRAM Snapdragon SoC STMicroelectronics SystemC Texas Instruments TI TSMC USB verification video Wide I/O XilinxTop Posts
- Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Ambarella cuts power on HD camera controller SoC using Samsung 32nm process technology
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
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Tag Archives: Broadcom
EDPS (April 5-6) in Monterey tackles “Top EDA Problems” with speakers from Broadcom, Cadence, AMD, and Synopsys
Early next month in Monterey, California, the Electronic Design Processes Symposium will take on the “Top Five EDA Problems.” For the purpose of this event, these problems would appear to be DFT (design for testability), System-Level EDA, Parallel EDA, and … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged AMD, Broadcom, Cadence, RTL, Synopsys
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Would you like some ARM Cortex-A15 resources to peruse?
Thanks to LinkedIn ARM Based Group community manager Stephan Cadene, we’ve got several pointers to useful documents describing many aspects of the ARM Cortex-A15 processor core. This is all in preparation for many discussions of the ARM Cortex-A15 processor taking … Continue reading
Posted in Android, ARM, Cortex-A15, Ecosystem, EDA360, IP, Silicon Realization, SoC, SoC Realization, System Realization
Tagged ARM architecture, Broadcom, Cortex-A15, Cortex-A5, Cortex-A8, Cortex-A9, Nvidia, Samsung, ST Ericsson, TechCon, Texas Instruments
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Which semiconductor vendors are the top four IC design companies and why? (According to Gary Smith)
Gary Smith, probably the best-known EDA analyst in the country, has just published his top-4 list of IC design houses marketing semiconductors. Here’s the short version with brief explanations. (For the whole megillah, see his free report.) NVIDIA—Best vision of … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization
Tagged Broadcom, Nvidia, Samsung, STMicro
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3D Thursday: Raspberry Pi Foundation’s $25 ARM board boots Linux using stacked DRAM
Although it’s not presented at a 3D story to the public, the Raspberry Pi Foundation’s $25 alpha board based on a 700MHz ARM 11 processor is very much 3D because there’s an SDRAM stacked on top of the processor. Why? … Continue reading
Posted in 3D, EDA360, Firmware, Linux, Memory, Packaging, Silicon Realization
Tagged Broadcom, Raspberry Pi
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Globalfoundries, LSI Corp, and Broadcom help Editorial Director Ed Sperling give the industry a low-power report card. How did we score?
On Wednesday at DAC’s show-floor Pavilion, Low-Power Engineering’s Editorial Director Ed Sperling chaired a panel with the intent of giving the industry a report card on its low-power engineering efforts. Along with Sperling on the Pavilion platform were Andrew Brotman, … Continue reading
Posted in DAC, EDA360, Low Power, Silicon Realization, SoC Realization, System Realization
Tagged Broadcom, GlobalFoundries, LSI Corp
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Who was the big winner at this week’s Mobile World Congress? That would be ARM, wouldn’t it?
Among the big pile of announcements at this week’s Mobile World Congress in Barcelona, these announcements stand out: Broadcom takes one of everything. ElectronicsWeekly.com reports that Broadcom has licensed every ARM processor core from the flagship multiprocessor Cortex-A15 through the … Continue reading
Posted in ARM, EDA360
Tagged Broadcom, Mobile World Congress, Nvidia, Qualcomm, Texas Instruments
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