Tag Archives: Broadcom

EDPS (April 5-6) in Monterey tackles “Top EDA Problems” with speakers from Broadcom, Cadence, AMD, and Synopsys

Posted on March 9, 2012 by

Early next month in Monterey, California, the Electronic Design Processes Symposium will take on the “Top Five EDA Problems.” For the purpose of this event, these problems would appear to be DFT (design for testability), System-Level EDA, Parallel EDA, and … Continue reading →

Posted in EDA360, Silicon Realization, SoC Realization, System Realization | Tagged , , , , | Leave a comment

Would you like some ARM Cortex-A15 resources to peruse?

Posted on October 17, 2011 by

Thanks to LinkedIn ARM Based Group community manager Stephan Cadene, we’ve got several pointers to useful documents describing many aspects of the ARM Cortex-A15 processor core. This is all in preparation for many discussions of the ARM Cortex-A15 processor taking … Continue reading →

Posted in Android, ARM, Cortex-A15, Ecosystem, EDA360, IP, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , , , , , | Leave a comment

Which semiconductor vendors are the top four IC design companies and why? (According to Gary Smith)

Posted on September 7, 2011 by

Gary Smith, probably the best-known EDA analyst in the country, has just published his top-4 list of IC design houses marketing semiconductors. Here’s the short version with brief explanations. (For the whole megillah, see his free report.) NVIDIA—Best vision of … Continue reading →

Posted in EDA360, Silicon Realization, SoC Realization | Tagged , , , | Leave a comment

3D Thursday: Raspberry Pi Foundation’s $25 ARM board boots Linux using stacked DRAM

Posted on August 25, 2011 by

Although it’s not presented at a 3D story to the public, the Raspberry Pi Foundation’s $25 alpha board based on a 700MHz ARM 11 processor is very much 3D because there’s an SDRAM stacked on top of the processor. Why? … Continue reading →

Posted in 3D, EDA360, Firmware, Linux, Memory, Packaging, Silicon Realization | Tagged , | Leave a comment

Globalfoundries, LSI Corp, and Broadcom help Editorial Director Ed Sperling give the industry a low-power report card. How did we score?

Posted on June 10, 2011 by

On Wednesday at DAC’s show-floor Pavilion, Low-Power Engineering’s Editorial Director Ed Sperling chaired a panel with the intent of giving the industry a report card on its low-power engineering efforts. Along with Sperling on the Pavilion platform were Andrew Brotman, … Continue reading →

Posted in DAC, EDA360, Low Power, Silicon Realization, SoC Realization, System Realization | Tagged , , | Leave a comment

Who was the big winner at this week’s Mobile World Congress? That would be ARM, wouldn’t it?

Posted on February 18, 2011 by

Among the big pile of announcements at this week’s Mobile World Congress in Barcelona, these announcements stand out: Broadcom takes one of everything. ElectronicsWeekly.com reports that Broadcom has licensed every ARM processor core from the flagship multiprocessor Cortex-A15 through the … Continue reading →

Posted in ARM, EDA360 | Tagged , , , , | Leave a comment