Tag Archives: Qualcomm

Daniel Nenni at SemiWiki publishes a [very] brief history of the SoC

Posted on August 20, 2012 by sleibson2

Daniel Nenni has just posted a very brief history of the SoC, with heavy emphasis on SoCs for mobile products. The emphasis is probably warranted because mobile designs really have driven SoC design for the past decade. One of the … Continue reading →

Posted in EDA360, Silicon Realization, SoC, SoC Realization | Tagged , , , , , , , | Leave a comment

Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges

Posted on August 15, 2012 by sleibson2

A couple of days ago, I let you know that Cadence had just published a comprehensive book on mixed-signal SoC design and verification. The book’s title is the “Mixed-Signal Methodology Guide,” written by the top mixed-signal design experts from across … Continue reading →

Posted in EDA360, Mixed Signal, Silicon Realization, SoC, SoC Realization, Verification | Tagged , , , , | Leave a comment

Gary Smith proposes a 3-layer taxonomy for platform-based SoC design—Live from DAC 2012

Posted on June 4, 2012 by sleibson2

EDA’s chief analyst Gary Smith is high on IP subsystems—big ones. Only Gary calls them platforms. Why is Smith so enthusiastic? Because, as he says, he was wrong last year in his estimates of how much it costs to develop … Continue reading →

Posted in DAC, IP, SoC, SoC Realization, System Realization, Texas instruments | Tagged , , , , , , , , | Leave a comment

Want a peek at a possible Qualcomm 3D IC roadmap?

Posted on April 10, 2012 by sleibson2

“3D IC test wafers will run this year and high-volume 3D IC manufacturing will start in 2013,” concluded Riko Radojcic at the end of his EDPS keynote on 3D ICs held in Monterey, California last Friday. Radojcic is Qualcomm’s Director … Continue reading →

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , | Leave a comment

3D preview from EDPS: Qualcomm’s Director of Engineering Riko Radojcic talks 3D and 3D EDA

Posted on April 9, 2012 by sleibson2

Last week’s Electronic Design Process Symposium (EDPS) opened a rich new vein of 3D IC material and you’ll see a lot nuggets from me on that topic in the next few days. Meanwhile, Richard Goering has already published a post … Continue reading →

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , | Leave a comment

Is Low-Power design worth the costs? Live, sort of, from DVCon

Posted on March 6, 2012 by sleibson2

Last week at DVCon, Cadence sponsored a low-power-themed lunch with the promise “Earn Your Degree in the Low-Power Arts and Sciences.” The panel consisted of: Qi Wang, technical marketing group director, Cadence Ruggero Castagnetti, distinguished engineer, LSI Corp. Sushma Honnavara … Continue reading →

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Less than two weeks left for early-bird EDPS registration. Don’t miss 3D Friday, the other EDA speakers, or your chance to network for that matter

Posted on March 6, 2012 by sleibson2

EDPS (The Electronic Design Process Symposium) provides a dynamic venue for the exchange of ideas among the top thinkers, movers, and shakers in EDA, who focus on how chips and systems are designed in the electronics industry. Attendees of this … Continue reading →

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3D Thursday (late): Qualcomm’s Riko Radojcic to keynote 3D Friday at EDPS in Monterey, April 6

Posted on February 24, 2012 by sleibson2

EDPS—the world’s “best” conference devoted to discussing the processes needed for advanced electronic design—is dedicating its entire second day (Friday, April 6) to 3D IC topics. The just-announced keynote speaker is Riko Radojcic, Director of Design for Silicon Initiatives at … Continue reading →

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3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work

Posted on February 9, 2012 by sleibson2

I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading →

Posted in 2.5D, 3D, EDA360, imec, SoC, SoC Realization | Tagged , , , , , , , , , , , , , , , | Leave a comment

Time to get your Trek on? The Qualcomm Tricorder X-prize will award $10 million for development of an actual medical Tricorder

Posted on January 18, 2012 by sleibson2

In the original Star Trek series from the 1960s, creator Gene Roddenberry needed a prop that allowed his characters to quickly gather information from a scene to advance the plot at television speeds. According to Wikipedia, “The word ‘tricorder’ is … Continue reading →

Posted in EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , | Leave a comment

ExtremeTech.com provides some lessons to be learned from the Google Nexus One smartphone’s system-level design and Android 4.0—Ice Cream Sandwich

Posted on October 30, 2011 by sleibson2

Ryan Whitwam at ExtremeTech.com has written another insightful article on System Realization as it relates to the Google Nexus One smartphone’s supposed inability to run Ice Cream Sandwich (ICS), the latest and soon-to-be-introduced version of the Google Android OS. As … Continue reading →

Posted in 65nm, Android, ARM, EDA360, Ice Cream Sandwich, SoC Realization, System Realization | Tagged , , , , , | Leave a comment

Have you considered the Android factor in multi-core SoC processor management?

Posted on October 16, 2011 by sleibson2

Ryan Whitwam over at Extremetech.com has just published an interesting article comparing the system-level power-management approaches taken by the Nvidia Tegra 3 and Qualcomm Snapdragon 4 ARM-based multicore SoCs. Both of those products have been discussed here at the EDA360 … Continue reading →

Posted in Android, ARM, EDA360, Firmware, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , | Leave a comment

Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?

Posted on October 10, 2011 by sleibson2

As I reported by the EDA360 Insider more than two months ago—see “Qualcomm renames existing ARM-based Snapdragon mobile application processors and provides future roadmap”—Qualcomm has been discussing the 28nm version of its Snapdragon mobile SoC, called the Snapdragon 4. Now … Continue reading →

Posted in 28nm, ARM, EDA360, Silicon Realization, SoC, SoC Realization | Tagged , , , , , , | Leave a comment

Qualcomm renames existing ARM-based Snapdragon mobile application processors and provides future roadmap

Posted on August 3, 2011 by sleibson2

Several articles on the Web today are discussing some new name changes to the Qualcomm line of Snapdragon mobile application processors to clarify the differences in the choices and to show a bit of the family’s future roadmap. Qualcomm now … Continue reading →

Posted in ARM, EDA360, Firmware, SoC Realization, System Realization | Tagged , , , , , | Leave a comment

Apps and gestures on tablets and smartphones: If I can see you shake your booty, what is it you expect me to do about it?

Posted on July 25, 2011 by sleibson2

Rick Merritt in EEtimes reports today that Qualcomm has just acquired some of the assets of gesture-recognition pioneer GestureTek and plans to insert that technology into future Snapdragon SoCs targeting smartphones, tablets, and consumer devices. Qualcomm’s Snapdragon SoCs are based … Continue reading →

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3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises

Posted on July 14, 2011 by sleibson2

Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading →

Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV | Tagged , , , , , , , , , , | 1 Comment

Heard at the IDC Smart Technology World conference: Qualcomm and Freescale presenters say System Realization is real and essential

Posted on April 22, 2011 by sleibson2

Earlier this week, I attended the IDC Smart Technology World conference and heard many interesting presentations. Two back-to back presentations with some similar messages came from Reiner Klement, VP of Product Management at Qualcomm CDMA Technologies and Dr. Lisa Su, … Continue reading →

Posted in Ecosystem, EDA360, System Realization | Tagged , | Leave a comment

Who was the big winner at this week’s Mobile World Congress? That would be ARM, wouldn’t it?

Posted on February 18, 2011 by sleibson2

Among the big pile of announcements at this week’s Mobile World Congress in Barcelona, these announcements stand out: Broadcom takes one of everything. ElectronicsWeekly.com reports that Broadcom has licensed every ARM processor core from the flagship multiprocessor Cortex-A15 through the … Continue reading →

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