Tag Archives: Qualcomm

Daniel Nenni at SemiWiki publishes a [very] brief history of the SoC

Daniel Nenni has just posted a very brief history of the SoC, with heavy emphasis on SoCs for mobile products. The emphasis is probably warranted because mobile designs really have driven SoC design for the past decade. One of the … Continue reading

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Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges

A couple of days ago, I let you know that Cadence had just published a comprehensive book on mixed-signal SoC design and verification. The book’s title is the “Mixed-Signal Methodology Guide,” written by the top mixed-signal design experts from across … Continue reading

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Posted in EDA360, Mixed Signal, Silicon Realization, SoC, SoC Realization, Verification | Tagged , , , , | Leave a comment

Gary Smith proposes a 3-layer taxonomy for platform-based SoC design—Live from DAC 2012

EDA’s chief analyst Gary Smith is high on IP subsystems—big ones. Only Gary calls them platforms. Why is Smith so enthusiastic? Because, as he says, he was wrong last year in his estimates of how much it costs to develop … Continue reading

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Want a peek at a possible Qualcomm 3D IC roadmap?

“3D IC test wafers will run this year and high-volume 3D IC manufacturing will start in 2013,” concluded Riko Radojcic at the end of his EDPS keynote on 3D ICs held in Monterey, California last Friday. Radojcic is Qualcomm’s Director … Continue reading

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , | Leave a comment

3D preview from EDPS: Qualcomm’s Director of Engineering Riko Radojcic talks 3D and 3D EDA

Last week’s Electronic Design Process Symposium (EDPS) opened a rich new vein of 3D IC material and you’ll see a lot nuggets from me on that topic in the next few days. Meanwhile, Richard Goering has already published a post … Continue reading

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , | Leave a comment

Is Low-Power design worth the costs? Live, sort of, from DVCon

Last week at DVCon, Cadence sponsored a low-power-themed lunch with the promise “Earn Your Degree in the Low-Power Arts and Sciences.” The panel consisted of: Qi Wang, technical marketing group director, Cadence Ruggero Castagnetti, distinguished engineer, LSI Corp. Sushma Honnavara … Continue reading

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Less than two weeks left for early-bird EDPS registration. Don’t miss 3D Friday, the other EDA speakers, or your chance to network for that matter

EDPS (The Electronic Design Process Symposium) provides a dynamic venue for the exchange of ideas among the top thinkers, movers, and shakers in EDA, who focus on how chips and systems are designed in the electronics industry. Attendees of this … Continue reading

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3D Thursday (late): Qualcomm’s Riko Radojcic to keynote 3D Friday at EDPS in Monterey, April 6

EDPS—the world’s “best” conference devoted to discussing the processes needed for advanced electronic design—is dedicating its entire second day (Friday, April 6) to 3D IC topics. The just-announced keynote speaker is Riko Radojcic, Director of Design for Silicon Initiatives at … Continue reading

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3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work

I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading

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Time to get your Trek on? The Qualcomm Tricorder X-prize will award $10 million for development of an actual medical Tricorder

In the original Star Trek series from the 1960s, creator Gene Roddenberry needed a prop that allowed his characters to quickly gather information from a scene to advance the plot at television speeds. According to Wikipedia, “The word ‘tricorder’ is … Continue reading

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ExtremeTech.com provides some lessons to be learned from the Google Nexus One smartphone’s system-level design and Android 4.0—Ice Cream Sandwich

Ryan Whitwam at ExtremeTech.com has written another insightful article on System Realization as it relates to the Google Nexus One smartphone’s supposed inability to run Ice Cream Sandwich (ICS), the latest and soon-to-be-introduced version of the Google Android OS. As … Continue reading

Posted in 65nm, Android, ARM, EDA360, Ice Cream Sandwich, SoC Realization, System Realization | Tagged , , , , , | Leave a comment

Have you considered the Android factor in multi-core SoC processor management?

Ryan Whitwam over at Extremetech.com has just published an interesting article comparing the system-level power-management approaches taken by the Nvidia Tegra 3 and Qualcomm Snapdragon 4 ARM-based multicore SoCs. Both of those products have been discussed here at the EDA360 … Continue reading

Posted in Android, ARM, EDA360, Firmware, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , | Leave a comment

Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?

As I reported by the EDA360 Insider more than two months ago—see “Qualcomm renames existing ARM-based Snapdragon mobile application processors and provides future roadmap”—Qualcomm has been discussing the 28nm version of its Snapdragon mobile SoC, called the Snapdragon 4. Now … Continue reading

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Qualcomm renames existing ARM-based Snapdragon mobile application processors and provides future roadmap

Several articles on the Web today are discussing some new name changes to the Qualcomm line of Snapdragon mobile application processors to clarify the differences in the choices and to show a bit of the family’s future roadmap. Qualcomm now … Continue reading

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Apps and gestures on tablets and smartphones: If I can see you shake your booty, what is it you expect me to do about it?

Rick Merritt in EEtimes reports today that Qualcomm has just acquired some of the assets of gesture-recognition pioneer GestureTek and plans to insert that technology into future Snapdragon SoCs targeting smartphones, tablets, and consumer devices. Qualcomm’s Snapdragon SoCs are based … Continue reading

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3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises

Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading

Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV | Tagged , , , , , , , , , , | 1 Comment

Heard at the IDC Smart Technology World conference: Qualcomm and Freescale presenters say System Realization is real and essential

Earlier this week, I attended the IDC Smart Technology World conference and heard many interesting presentations. Two back-to back presentations with some similar messages came from Reiner Klement, VP of Product Management at Qualcomm CDMA Technologies and Dr. Lisa Su, … Continue reading

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Who was the big winner at this week’s Mobile World Congress? That would be ARM, wouldn’t it?

Among the big pile of announcements at this week’s Mobile World Congress in Barcelona, these announcements stand out: Broadcom takes one of everything. ElectronicsWeekly.com reports that Broadcom has licensed every ARM processor core from the flagship multiprocessor Cortex-A15 through the … Continue reading

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