Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- 10 ways to get your EDA tools to run faster, smoother, and longer
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- Friday Video: Ready for a little mobile phone teardown archaeology? Dave Jones compares state of the art in 1994 (Motorola) with an evolved 2000 (Nokia)
- 20nm design: What have we learned so far?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
Download the EDA360 Vision Paper here:
Tag Archives: DDR3
AMD’s new Trinity APU (Accelerated Processing Unit) for laptops/notebooks is a poster child for IP-centric SoC design
Yesterday, AMD introduced its second generation of A-series APUs (Accelerated Processing Units) that combine two to four Piledriver x86 microprocessor cores—each with 2Mbytes of L2 cache memory—with a Radeon 7000 GPU (Graphics Processing Unit), an HD Media Accelerator, a display … Continue reading
Posted in 32nm, EDA360, Silicon Realization, SoC, SoC Realization
Tagged Advanced Micro Devices, AMD, APU, DDR3, GPU, PCI Express, PCIe, Radeon
Leave a comment
Who else wants to learn high-speed PCB design and signal integrity analysis from world-renown expert Robert Hanson—for FREE?
Do the words “high-speed PCB design” make you twitch uncontrollably? How about “signal integrity analysis”? “Crosstalk”? Perhaps the phrase “complex power-delivery networks” is your nemesis. All of these topics can be real bears to deal with when you are laying … Continue reading
Posted in EDA360, Packaging, pcb
Tagged DDR3, DDR4, PDN, power distribution network, Robert Hanson, signal integrity
1 Comment
How can you be sure DDR2, DDR3, and DDR4 SDRAMs will work properly in your system?
LeCroy introduced an upgrade to its Kibra 380 DDR3 SDRAM protocol analyzer today. The analyzer’s probes plug in series with the DDR3 SDRAM modules and the analyzer can identify more than 65 JEDEC command protocol and timing violations in real … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization, Verification
Tagged DDR2, DDR3, DDR4, IDF, Intel Developer Forum
Leave a comment
JEDEC releases more details about DDR4 SDRAM spec. Want to know what they are?
Although DDR3 memory is just ramping up in sales, JEDEC has been working on the next-generation DDR4 specification for faster SDRAM that consumes even less power. To achieve these goals, JEDEC announced yesterday that has specified the following key features … Continue reading
Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
Last week, I quoted Ann Steffora Mutschler’s article about the information that Micron has revealed about it’s 3D Hybrid Memory Cube. Now that I’ve got the paper Micron presented at last week’s Hot Chips 23 conference, I’d like to explain … Continue reading
Friday Video: What’s Next For Memory Designs In 2012? – from Agilent
Agilent has created a 6-part video series titled “What’s Next For Memory Designs In 2012?” that’s well worth a look. There’s about 30 minutes of video total, chopped into 2-8 minute pieces that you’ll want to watch if you have any … Continue reading
Urgent: You have only 24 hours to sign up for a free DDR4 Webinar including just-released info from the JEDEC committee
I just heard from the Cadence memory interface guru himself, Marc Greenberg, about a DDR4 Webinar he’s giving tomorrow (Thursday) during the EETimes Virtual SoC event. Here’s what Marc wrote: “I am presenting a Webinar on DDR4 tomorrow (Thursday) at … Continue reading
EDA360 Insider 