(You do not know how hard it was to write that headline.) Let’s say you need a really small exploration vehicle to check out the ruins of a natural disaster to search for survivors. Nature has been at this design … Continue reading
Semiconductors are not the only things made in fabs.
Dave Jones down in Australia (not Austria!) is attending the Australian Electronex show in Sydney and he’s posted a long video where representatives from the IPC Designers Council discuss the relatively new IPC-2581 standard for describing printed circuit boards and … Continue reading
Rick Merritt has just published an interesting article in EETimes: the PCI Special Interest Group (PCI SIG) expects to announce an adaptation of the ever-popular PCIe interface for mobile devices including smartphones. Merritt reports that the PCI SIG and MIPI … Continue reading
There’s a strange little high-rise hotel called the Biltmore in the center of Silicon Valley at the intersection of the Montague Expressway and Highway 101. It’s going to be the site of this year’s “Roadmaps for Multi Die Integration” conference … Continue reading
On October 17, Jim Hogan’s second “conversation” in his Emerging Companies Series will deal with a key topic for EDA entrepreneurs: “How to Raise Money and How Not to Spend It.” Hogan’s guests include Amit Gupta, President and CEO of … Continue reading
You have a little more than a day to register for the free Freescale Webinar on using the company’s Kinetis L microcontrollers based on the relatively new ARM Cortex-M0+ processor core. These are relatively new microcontrollers, just rolling out now, … Continue reading
Here’s a short film about augmented reality in the near future by Eran May-raz and Daniel Lazo. This is their graduation project from Bezaleal academy of arts. Scary, depressing, or cool? I guess the answer depends on your demographic.
Kickstarter, a funding force of nature in the cyberscape, is funding the small-scale production of an Arduino-like development board based on a Freescale Kinetis K microcontroller (ARM Cortex-M4 processor core inside). More than 500 backers have pledged nearly $23,000 $31,000 … Continue reading
Robert Patti, Chief Technical Officer and VP of Design Engineering at Tezzaron Semiconductor is the just-announced speaker at the Known Good Die conference being held on November 15 in Santa Clara, CA. His topic: Using Repair & Redundancy with KGD … Continue reading
Have you ever wondered how we got from a world solely occupied by semiconductor vendors with their own fabs to today’s hodgepodge of IDMs (independent device manufacturers, the new name for the old-style “semiconductor vendor”), fab-lite vendors, and fables vendors? … Continue reading
Texas Instruments’ Stellaris LM4F120H5QRC microcontroller is based on an 80MHz copy of the ARM Cortex-M4F processor core with an integrated single-precision floating-point unit. It also includes 256Kbytes of Flash memory, 32Kbytes of SRAM, 2Kbytes of EEPROM, and a host … Continue reading
One of the silliest high-concept ideas in the Avengers movie has to be the flying aircraft carrier operated by super-secret agency S.H.I.E.L.D. Well, it’s from the comic books, right? Then why does it come as no surprise that someone has … Continue reading
You can now add Samsung to a small-but-growing list of digital camera vendors offering Android-based point-and-shoot cameras. The first was Nikon, announcing the S800c camera last week. (See “Nikon announces Android-powered camera: the $349 Coolpix S800c”) Now Samsung has introduced … Continue reading
SemiWiki blogger and EDA Consultant Daniel Payne has just published a second, more extensive review of the new Mixed-Signal Methodology book just published by Cadence. He has included extensive technical information from the book in his review, so if you’re … Continue reading
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
Today at the Hot Chips 24 conference, George Chrysos discussed the Intel MIC (Many Integrated Core) architecture of the Knights Bridge chip, to be formally called the Intel Xeon Phi coprocessor. This chip runs Linux, but it’s designed to act … Continue reading
EDA analyst and SemiWiki writer Paul McLellan published an article on 20nm design last week. It’s based on the Cadence White Paper on the same topic. You can see Paul’s article here. The Cadence 20nm White Paper is here.
“I am, and ever will be, a white-socks, pocket-protector, nerdy engineer and I take a substantial amount of pride in the accomplishments of my profession.” Neil Armstrong, first person to step on the Earth’s moon, Apollo 11. Godspeed, Neil.
Sparkfun Electronics in Boulder, Colorado runs a new-product video every Friday. Today, the video features a board-level product called a HackHD, which is essentially the electronic guts of a $199.99 GoPro rugged camcorder. The HackHD sells for $159.95. As usual, … Continue reading
Before he has to return his 13GHz, 40Gsamples/sec Agilent 90000 series loaner scope (Digital Signal Analyzer) and its equally pricey test probes, Dave Jones uses it to check out the 5Gbps USB 3.0 signaling and signal integrity in a new … Continue reading
The “Village of Yore” in the town of Hoshaya, Israel has augmented its live donkey ride through its historic village with WiFi communications so that tourists can snap photos and immediately upload them. They can tweet, post on Facebook, etc, … Continue reading
This short video shows an anthropomorphic robot named PETMAN, a DARPA project from Boston Dynamics, with a soundtrack added by a YouTube user. Fun! By the way, I saw a preview of the movie “Robot and Frank” last weekend. Also … Continue reading
A 1-day workshop on Analog and Mixed-Signal Design Automation will be held on November 8 in conjunction with ICCAD in Silicon Valley. It’s no secret that advanced-node process scaling makes all IC design more complex and more challenging—even more so … Continue reading