Tag Archives: LPDDR2

3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power

Posted on August 29, 2012 by

Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading →

Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , , | 7 Comments

Friday Video: Dave Jones’ Amazon Kindle Fire teardown reveals several System Realization secrets

Posted on December 2, 2011 by

Everyone enjoys a good product teardown and no one does them better than Dave Jones, who publishes the EEVBlog. This week, Dave tore into the new Amazon Kindle Fire tablet and reveals a few juicy tidbits from its system design. … Continue reading →

Posted in System Realization | Tagged , , , , , , , | 2 Comments