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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- What do you do when two processors just won’t do? TI’s OMAP 5 SoCs sport 4-in-hand ARM cores, IP Subsystems
- Friday Video (late): Fully operational “Lost in Space” B9 Robot, $24500
- 3D Thursday: Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (UPDATED!)
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- Between ASIC and microcontroller: It’s all about System Realization
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Collaboration is key to making DFM work at 28nm and below
- 10 ways to get your EDA tools to run faster, smoother, and longer
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Tag Archives: LPDDR2
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
7 Comments
Friday Video: Dave Jones’ Amazon Kindle Fire teardown reveals several System Realization secrets
Everyone enjoys a good product teardown and no one does them better than Dave Jones, who publishes the EEVBlog. This week, Dave tore into the new Amazon Kindle Fire tablet and reveals a few juicy tidbits from its system design. … Continue reading
Posted in System Realization
Tagged Amazon Kindle, Amazon Kindle Fire, ARM processor, DDR, Kindle Fire, LPDDR2, OMAP, Texas Instruments OMAP
2 Comments
