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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- 3D Thursday: 28nm design and 2.5D packaging saves Xilinx a ton of power. You can too even if you're not designing FPGAs!
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- ARM big.LITTLE multicore IP architecture wins a Microprocessor Report Analysts’ Choice Award
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- Learn to use AI in design work after a great slice of Costco pizza. The talk is free. Pizza: $2
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
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Tag Archives: LPDDR2
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
7 Comments
Friday Video: Dave Jones’ Amazon Kindle Fire teardown reveals several System Realization secrets
Everyone enjoys a good product teardown and no one does them better than Dave Jones, who publishes the EEVBlog. This week, Dave tore into the new Amazon Kindle Fire tablet and reveals a few juicy tidbits from its system design. … Continue reading
Posted in System Realization
Tagged Amazon Kindle, Amazon Kindle Fire, ARM processor, DDR, Kindle Fire, LPDDR2, OMAP, Texas Instruments OMAP
2 Comments
