Tag Archives: mobile phone

3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power

Posted on August 29, 2012 by

Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading →

Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , , | 7 Comments

3D Thursday: Count Renesas in with the 3D IC poker game, says Nikkei Electronics

Posted on January 26, 2012 by

Last week, Masahide Kimura at Nikkei Electronics in Japan published an article titled “Renesas to Commercialize TSV Technology for Wide I/O DRAM-compatible Mobile SoCs” that clearly puts Renesas in the middle of the industry’s 3D IC efforts. Reading between the … Continue reading →

Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O | Tagged , , , , | Leave a comment

More on the cost of adding LTE to a mobile phone handset. It’s not “just” $39.75. Add at least $10 for the bigger battery.

Posted on July 13, 2011 by

Here’s a follow-up to my blog post on the IHS report on the cost of adding LTE to a mobile phone handset. (See “What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.”) I … Continue reading →

Posted in EDA360, Silicon Realization, SoC Realization, System Realization | Tagged , , | Leave a comment