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- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- 3D Thursday: 28nm design and 2.5D packaging saves Xilinx a ton of power. You can too even if you're not designing FPGAs!
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- ARM big.LITTLE multicore IP architecture wins a Microprocessor Report Analysts’ Choice Award
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- Learn to use AI in design work after a great slice of Costco pizza. The talk is free. Pizza: $2
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
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Tag Archives: mobile phone
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
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3D Thursday: Count Renesas in with the 3D IC poker game, says Nikkei Electronics
Last week, Masahide Kimura at Nikkei Electronics in Japan published an article titled “Renesas to Commercialize TSV Technology for Wide I/O DRAM-compatible Mobile SoCs” that clearly puts Renesas in the middle of the industry’s 3D IC efforts. Reading between the … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged JEDEC, mobile phone, Renesas, SoC, Wide I/O
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More on the cost of adding LTE to a mobile phone handset. It’s not “just” $39.75. Add at least $10 for the bigger battery.
Here’s a follow-up to my blog post on the IHS report on the cost of adding LTE to a mobile phone handset. (See “What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.”) I … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged handset, LTE, mobile phone
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