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- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
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- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- AppliedMicro demos FPGA emulation of multicore server chip based on new 64-bit ARMv8 architecture
- Semico reports that ASICS, ASSPs, SoCs, and core-based ICs comprise the fastest growing category in MOS logic chips
- FREE DAC 2012 Exhibit 3-day passes. Limited quantity. Time-limited offer. Get ‘em NOW!
- Want to see the future of low-power SoC design? Have a look into Gary Smith’s crystal ball.
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Common Platform: Why do these companies (IBM, Samsung, GLOBALFOUNDRIES) collaborate?
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- 3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
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Tag Archives: mobile phone
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
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3D Thursday: Count Renesas in with the 3D IC poker game, says Nikkei Electronics
Last week, Masahide Kimura at Nikkei Electronics in Japan published an article titled “Renesas to Commercialize TSV Technology for Wide I/O DRAM-compatible Mobile SoCs” that clearly puts Renesas in the middle of the industry’s 3D IC efforts. Reading between the … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged JEDEC, mobile phone, Renesas, SoC, Wide I/O
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More on the cost of adding LTE to a mobile phone handset. It’s not “just” $39.75. Add at least $10 for the bigger battery.
Here’s a follow-up to my blog post on the IHS report on the cost of adding LTE to a mobile phone handset. (See “What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.”) I … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged handset, LTE, mobile phone
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