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- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- What would you do with a 23,000-simultaneous-thread school of piranha?...asks NVIDIA
- Qualcomm renames existing ARM-based Snapdragon mobile application processors and provides future roadmap
- Intel says Moore’s Law alive and well and living at 32nm
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
- IBM to manufacture 32nm SOI chips with eDRAM in new GLOBALFOUNDRIES Fab 8 (Malta, NY)
- Mindspeed, VOIP chip design, and the new SoC Design Paradigm
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
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Tag Archives: mobile phone
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
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3D Thursday: Count Renesas in with the 3D IC poker game, says Nikkei Electronics
Last week, Masahide Kimura at Nikkei Electronics in Japan published an article titled “Renesas to Commercialize TSV Technology for Wide I/O DRAM-compatible Mobile SoCs” that clearly puts Renesas in the middle of the industry’s 3D IC efforts. Reading between the … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged JEDEC, mobile phone, Renesas, SoC, Wide I/O
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More on the cost of adding LTE to a mobile phone handset. It’s not “just” $39.75. Add at least $10 for the bigger battery.
Here’s a follow-up to my blog post on the IHS report on the cost of adding LTE to a mobile phone handset. (See “What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.”) I … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged handset, LTE, mobile phone
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