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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- “Professor” Aart de Geus gives latest Techonomics lecture on collaboration and System Realization at the Semico Summit in Scottsdale
- Intel says Moore’s Law alive and well and living at 32nm
- How do virtual prototyping, emulation, and FPGA prototyping differ? Answers from Frank Schirrmeister
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
- Why doesn’t your pc board work?
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Tag Archives: eMMC
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
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