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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- After Silicon, SoC, and System Realization comes Dynasty Realization
- 20nm design: What have we learned so far?
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- Itching to try out the Xilinx Zynq-7000 EPP? Ask your doctor if Zedboard is right for you
- Agilent knocks one out of the park with new, low-cost line of digital scopes—a very competitive entry into the low-end DSO market and a perfect example of EDA360 design using end-to-end design and apps.
- Samsung 20nm test chip includes ARM Cortex-M0 processor core. How many will fit on the head of a pin?
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
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Category Archives: SoC
3D Thursday: Hella big conference on multi-die integration in the heart of Silicon Valley
There’s a strange little high-rise hotel called the Biltmore in the center of Silicon Valley at the intersection of the Montague Expressway and Highway 101. It’s going to be the site of this year’s “Roadmaps for Multi Die Integration” conference … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization
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3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
7 Comments
Zowie! More than 50 x86 cores on the Intel Knights Corner Manycore Coprocessor
Today at the Hot Chips 24 conference, George Chrysos discussed the Intel MIC (Many Integrated Core) architecture of the Knights Bridge chip, to be formally called the Intel Xeon Phi coprocessor. This chip runs Linux, but it’s designed to act … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged GDDR5, Intel, Knights Bridge, Manycore, Phi, Xeon
2 Comments
Daniel Nenni at SemiWiki publishes a [very] brief history of the SoC
Daniel Nenni has just posted a very brief history of the SoC, with heavy emphasis on SoCs for mobile products. The emphasis is probably warranted because mobile designs really have driven SoC design for the past decade. One of the … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization
Tagged Apple, Daniel Nenni, Nvidia Tegra, Qualcomm, Samsung, SemiWiki, Snapdragon, Texas Instruments OMAP
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Friday Video: A personal invitation to Memcon from Sanjay Srivastava
Want to know why you need to be at Memcon this year? Here’s Denali Software founder Sanjay Srivastava to tell you why: Now go and sign up! It’s a free ticket and includes breakfast, lunch, and some goodies—not to mention … Continue reading
Posted in Memory, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Denali, DRAM, Dynamic random-access memory, Flash, Flash memory, JEDEC, Memcon, SDRAM
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Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
A couple of days ago, I let you know that Cadence had just published a comprehensive book on mixed-signal SoC design and verification. The book’s title is the “Mixed-Signal Methodology Guide,” written by the top mixed-signal design experts from across … Continue reading
Posted in EDA360, Mixed Signal, Silicon Realization, SoC, SoC Realization, Verification
Tagged Boeing, Cadence, Mixed Signal, Qualcomm, SoC
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Samsung Exynos 5 Dual mobile processor features two 1.7GHz ARM Cortex-A15 processors, a WQXGA display controller, and two LPDDR3 controllers to feed ‘em
This past weekend, the Web was abuzz with last week’s unveiling of Samsung’s Exynos 5 Dual mobile processor. This SoC features two 1.7GHz ARM Cortex-A15 processors rather than the previous Exynos generation Dual mobile processor that incorporated two 1.4GHz ARM … Continue reading
Posted in Cortex-A15, EDA360, Samsung, Silicon Realization, SoC, SoC Realization
Tagged ARM Cortex-A15, ARM Cortex-A9 MPCore, Exynos 5 Dual, Samsung, White Paper
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Looking for an introductory Verilog book? How’s $24.95 sound?
Bob Zeidman, founder and president of Zeidman Consulting, has just published the third edition of his book “Introduction to Verilog.” It was first published a dozen years ago and is based on the Verilog seminars that Zeidman has given at … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization, Verilog
Tagged Bob Zeidman, Hardware description language, Verilog, Zeidman
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Need to make an ARM Cortex-A9 processor core all it can be?
A new blog published today on the ARM Web site titled “How do you take an ARM POP up one more notch?” describes a very recent collaboration between ARM and Cadence to enhance the ARM POP IP, which helps any … Continue reading
Posted in 40nm, ARM, Cortex-A9, Silicon Realization, SoC, SoC Realization, TSMC
Tagged 40nm, ARM architecture, ARM Cortex-A9, process technology, TSMC
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If Aladdin’s Genie lived in a Computer-on-Module, it might look like the Gumstix Overo
One of the funniest lines in the 1992 animated Disney movie “Aladdin” is when the frenetic blue Genie, voiced by the incredible Robin Williams, describes his situation: “PHENOMENAL COSMIC POWERS; Itty-bitty living space,” referring to his life in a lamp. … Continue reading
5-minute, 20nm Q&A. All you need to know in 5 minutes.
What are the key advantages of moving to 20nm? There are three primary reasons why we are seeing more system and semiconductor companies consider 20nm: performance, power, and area (PPA). Essentially, this is a “next-node” answer, which is still as … Continue reading
Posted in 20nm, Silicon Realization, SoC, SoC Realization
Tagged 20nm, LDE, Multiple patterning, PPA
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Cavium “Thunders” approval of 64-bit ARM v8 processor cores for cloud and server apps
In an unusual press release, network processor vendor Cavium has revealed plans for Project Thunder,” which will develop a family of multi-core SoCs based on the 64-bit ARM v8 processor architecture. The processors will be full-custom cores based on the … Continue reading
Posted in ARM, EDA360, Silicon Realization, SoC, SoC Realization
Tagged ARM architecture, ARM v8, Cavium, Cavium Networks, MIPS architecture, Multi-core processor
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3D Thursday: Wide I/O and TSVs have a ripple effect on the DRAM controller. Who knew?
Currently, the JEDEC Wide I/O DRAM specification looks to be the biggest driving force behind the adoption of 3D IC assembly. The 512-bit data maw of a Wide I/O SDRAM provides high bandwidth with low power levels, both excellent arguments … Continue reading
Posted in 2.5D, 3D, DAC, EDA360, IP, Silicon Realization, SoC, SoC Realization, System Realization, TSV, Wide I/O
Tagged DRAM, JEDEC, Marc Greenberg, Mobile device, SDRAM, Wide I/O
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3D Thursday: Will water cooling for 3D IC assemblies ever be practical?
Last week, Brian Bailey published an interview with Professor Madhavan Swaminathan who is the Director of the Interconnect and Packaging Center (IPC) at Georgia Tech in Atlanta. The topic of the interview was cooling of 3D IC devices. It’s no … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 3D, Aquasar, Brian Bailey, FLOPS, IBM, Integrated circuit, SuperMUC, Water cooling
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3D Thursday: Magnificent Max explains 3D IC in simple terms
If you’re looking for simplified explanations of technical topics, few people write them as well as Clive “Max” Maxfield. His simplified 3-page explanation of 3D IC assembly is here. (Note: Registration needed to go past page 1, unfortunately.)
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 3D
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Can 1000 processors dance on the head of a pin? MIT’s Professor Srini Devadas hopes so
Veteran EDA industry watcher Peggy Aycinena visited MIT recently and spoke with Professor Srini Devadas about a manycore processor project called “Angstrom.” The purpose of the project is to develop massively parallel hardware—as in 1024 processors—to explore better ways of … Continue reading
Posted in Apps, EDA360, Silicon Realization, SoC, SoC Realization
Tagged angstrom project, asymmetric, IBM, MIT, symmetric, Twilight Zone
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Two more low-cost dev boards based on the ARM Cortex-M4 with 1Mbyte of Flash, 192Kbytes of RAM: $15.57 and up
Thanks to http://www.chibios.org, I’ve just learned of two low-cost development boards based on the STMicroelectronics STM32F07 microcontroller. You might be interested in these boards because one costs $15.57 and the other sells for 39.95€. The lower-cost board is from STMicroelectronics … Continue reading
Posted in ARM, Cortex-M4, SoC, SoC Realization
Tagged ARM, Arrow Electronics, Cortex, Flash, Flash memory, M4, Secure Digital, ST Microelectronics, STMicroelectronics, USB, USB On-The-Go
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ARM, TSMC announce collaboration on FINfet-based ARM v8 processor core for sub-20nm SoC designs
Today, ARM and TSMC announced a multi-year deal to develop a 64-bit ARM v8 processor “beyond” the 20nm node using FINfets. The collaboration includes the ARMv8 architecture, ARM Artisan physical IP, and TSMC’s FinFET process technology. The target of this … Continue reading
Posted in 10nm, 14nm, 20nm, ARM, EDA360, Silicon Realization, SoC, SoC Realization
Tagged ARM, FinFET, TSMC
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3D Thursday: Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor
Ann Steffora-Mutschler just published an interview with Robert Patti, chief technology officer at Tezzaron Semiconductor, that gives some terrific technical detail about 2.5D and 3D IC design and assembly. Patti provides some rare insight into today’s (as in right now) … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 3D, Tezzaron
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Innovate or die! A high-tech parable from this week’s Time Magazine
Today I was reading this week’s issue of Time Magazine while eating lunch in my secret fish-and-chips restaurant at an undisclosed location in Milpitas, California when I chanced upon a fascinating article about RIM, maker of the BlackBerry. The article’s … Continue reading
Posted in 2.5D, 20nm, 28nm, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Android, BlackBerry, FPGA, iPhone, John Roberts, RIM
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High-level synthesis, C versus assembly code, and Leibson’s Law
Years ago, when I was Editor-in-Chief of EDN Magazine, I coined (but did not name) Leibson’s Law: “It takes 10 years for any disruptive technology to become pervasive in the design community.” I was reminded of that observation while reading … Continue reading
Posted in Design Abstraction, EDA360, SoC, SoC Realization, System Realization, SystemC
Tagged ASIC, High-level synthesis, LinkedIn, SoC, SystemC
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3D Thursday (Late): Sony to invest 80 billion Yen in stacked CMOS sensor manufacturing expansion
Quoting a corporate press release, the Web site http://www.dpreview.com reports that Sony Corp intends to invest approximately 80 billion Yen through the end of March, 2014 to expand its capacity to manufacture “stacked silicon sensors,” which are 3D IC assemblies … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization
Tagged 3D, backside illumination, Sony, stacked silicon
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Friday Video: EDA360 Insider talks HW/SW Codesign and Xilinx Zynq Dev Board with ChipEstimate.TV at DAC
I spent a few minutes with Sean O’Kane of ChipEstimate.TV at DAC earlier this month talking about system design, HW/SW codesign, and the new Avnet Dev Board for the Xilinx Zynq-7000 EPP. Here’s the video:
Posted in DAC, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Xilinx, Zynq
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Friday Video: Freescale pits Kinetis L microcontroller against parts from Microchip, TI, and Renesas. Guess who wins the low-power derby?
I’ve written a lot this week about the low-power Kinetis L microcontroller from Freescale, a low-power, mixed-signal IC design now shipping in alpha silicon. I have just found this new Freescale video, which was probably shot at this week’s Freescale … Continue reading
Posted in ARM, Cortex-M0, EDA360, Low Power, Mixed Signal, Silicon Realization, SoC, SoC Realization
Tagged ARM architecture, Cortex-M0, Freescale, Freescale Semiconductor, microcontroller
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The Freescale Kinetis L microcontrollers based on the ARM Cortex-M0+ processor core: But what do they do???
A couple of days ago, I wrote that Freescale had announced that it was shipping alpha samples of its new Kinetis L microcontroller, which is based on the 32-bit ARM Cortex-M0+ processor core. (See “Freescale starts sampling $0.49 Kinetis L … Continue reading
Posted in Cortex-M0, EDA360, Mixed Signal, SoC, SoC Realization
Tagged ARM architecture, Cortex-M0, Flash memory, Freescale, Freescale Kinetis L, Freescale Semiconductor
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