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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- Between ASIC and microcontroller: It’s all about System Realization
- Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Free live discussion on how you can develop the next great EDA company with host and perennial EDA VC Jim Hogan
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- What can you do with 45nm SOI? A lot, it turns out
- Samsung 20nm test chip includes ARM Cortex-M0 processor core. How many will fit on the head of a pin?
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Tag Archives: Medfield
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
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