3D Thursday: Hella big conference on multi-die integration in the heart of Silicon Valley

There’s a strange little high-rise hotel called the Biltmore in the center of Silicon Valley at the intersection of the Montague Expressway and Highway 101. It’s going to be the site of this year’s “Roadmaps for Multi Die Integration” conference on November 14 and if you are or will be involved in any aspect of 3D IC design, assembly, and packaging then you need to figure out how you can plant your tuchas on a chair at this event.

There are several important sessions at this conference including:

  • A Multi-Die Integration Strategies Session” led by Pat Tang of STATSChipPAC.
  • A session on “Enabling Multi Die Integration” led by Kumar Nagarajan of Xilinx
  • A session on “Emerging Technologies for Multi-Die Packaging” led by John Xie of Altera
  • A panel on “Drivers for Multi-Die Packaging” led by Ivor Barber of LSI Corp and Rich Rice of ASE

The keynote by Anwar Mohammed of Huawei Technologies looks to be just as interesting: “The Promises and Pitfalls of 2.5D Packaging…A User Perspective.

That’s a lot for one day.

Registration for MEPTEC members is $475 and it’s $575 for non-members.

More info here.

Registration is here.

About sleibson2

EDA360 Evangelist and Marketing Director at Cadence Design Systems (blog at https://eda360insider.wordpress.com/)
This entry was posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization. Bookmark the permalink.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s