Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- AppliedMicro demos FPGA emulation of multicore server chip based on new 64-bit ARMv8 architecture
- Semico reports that ASICS, ASSPs, SoCs, and core-based ICs comprise the fastest growing category in MOS logic chips
- FREE DAC 2012 Exhibit 3-day passes. Limited quantity. Time-limited offer. Get ‘em NOW!
- Want to see the future of low-power SoC design? Have a look into Gary Smith’s crystal ball.
- Want a peek at a possible Qualcomm 3D IC roadmap?
- Common Platform: Why do these companies (IBM, Samsung, GLOBALFOUNDRIES) collaborate?
- 3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package to handle bidirectional 100Gbps Ethernet
- 3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
Download the EDA360 Vision Paper here:
Tag Archives: PHY
Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
Rick Merritt has just published an interesting article in EETimes: the PCI Special Interest Group (PCI SIG) expects to announce an adaptation of the ever-popular PCIe interface for mobile devices including smartphones. Merritt reports that the PCI SIG and MIPI … Continue reading
Posted in EDA360, IP, Mobile, SoC Realization, System Realization
Tagged MIPI Alliance, PCI Express, PCI SIG, PHY
2 Comments
3D Thursday: 40G and 100G optical Ethernet—Killer 3D app? Perhaps. Compelling? Definitely.
I’ve written several times about Wide I/O DRAM and how its speed and power advantages make it a slam dunk and killer app for 3D IC assembly. I saw another such 3D IC killer app this week at the Ethernet … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 100 Gigabit Ethernet, 100G, 40G, AOC, Ethernet, Luxtera, MSA, PHY, Xilinx
5 Comments
Cadence announces synthesizable 40G and 100G Ethernet Controller, PCS, and BEAN (Backplane Ethernet Auto-Negotiation) IP
In conjunction with this week’s Ethernet Technology Summit being held in San Jose, Cadence has announced commercial availability of MAC (Media Access Control), PCS (Physical Coding Sublayer) and BEAN (Backplane Ethernet Auto-Negotiation) IP blocks. The 40/100G MAC controller is fully … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization
Tagged 100 Gigabit Ethernet, 100G, 40G, Ethernet, Gigabit Ethernet, Media Access Control, MII, PCS, PHY, SerDes, Verilog
Leave a comment
