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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Tag Archives: San Diego
Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
(You do not know how hard it was to write that headline.) Let’s say you need a really small exploration vehicle to check out the ruins of a natural disaster to search for survivors. Nature has been at this design … Continue reading
3D Thursday: Electronics Component and Technologies Conference in San Diego features several 3D learning opportunities. May 29-June 1.
The Electronics Component and Technologies Conference being held in San Diego on May 29-June 1 will provide you with several significant opportunities to come up to speed on 3D IC assembly and related topics including: Session 1 on 3D Interconnect … Continue reading
Posted in 2.5D, 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 3D, packaging, San Diego
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