Tag Archives: Tezzaron Semiconductor

3D Thursday: Produce cost-effective 2.5D and 3D devices. Attend the Known Good Die conference, November 15

Robert Patti, Chief Technical Officer and VP of Design Engineering at Tezzaron Semiconductor is the just-announced speaker at the Known Good Die conference being held on November 15 in Santa Clara, CA. His topic: Using Repair & Redundancy with KGD … Continue reading

Posted in 2.5D, 3D, EDA360, Silicon Realization | Tagged , , , | Leave a comment