Tag Archives: Supply chain

3D Thursday: Produce cost-effective 2.5D and 3D devices. Attend the Known Good Die conference, November 15

Robert Patti, Chief Technical Officer and VP of Design Engineering at Tezzaron Semiconductor is the just-announced speaker at the Known Good Die conference being held on November 15 in Santa Clara, CA. His topic: Using Repair & Redundancy with KGD … Continue reading

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