Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- My workbench from 1978 highlighted in EETimes as one of engineering’s messiest desks
- What’s it take to design DDR4 into your next SoC? Newly released DFI 3.0 Spec opens the flood gates for DDR4 design
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
Download the EDA360 Vision Paper here:
Category Archives: Firmware
How many engineers does it take to spin a chip?
The title of this blog entry paraphrases a very old joke category about light bulbs but the topic is serious because it goes to the heart of the electronic industry’s profitability. EDA analyst and ur chip-design guru Gary Smith discussed … Continue reading
Posted in DAC, EDA360, Firmware, Silicon Realization, SoC Realization, System Realization
Tagged Gary Smith
Leave a comment
Nvidia CEO Jen-Hsun Huang says Android tablets will overtake Apple’s iPad in 30 months
According to this article on Techspot.com, Nvidia CEO Jen-Hsun Huang told the audience at the Reuters Technology Summit in New York that Android tablets will overtake Apple’s iPad in 30 months. He said that it took the Android phone about … Continue reading
Posted in Android, EDA360, Firmware, Honeycomb
Tagged Android, Apple, Jen-Hsun Huang, tablet
Leave a comment
Jim Hogan details his views of SoC opportunities and again reveals his SoC Realization investment shopping list
Jim Hogan gave the keynote at today’s EETimes Virtual SoC event and he presented a deep dive into the opportunities in semiconductor device development and the associated EDA opportunities from the perspective of an investor who makes his money building, … Continue reading
Are you in tune with the bare naked realities of MPSoC development? System Realization in the 21st century.
My good friend Jack Ganssle just published a terrific article for http://www.embedded.com titled “Mars ate my spacecraft!” Ganssle is the most accessible authority on firmware development that I know and his article (a fast and easy read) is must reading … Continue reading
EDA360 Insider 