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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- My workbench from 1978 highlighted in EETimes as one of engineering’s messiest desks
- 3D Thursday: 28nm design and 2.5D packaging saves Xilinx a ton of power. You can too even if you're not designing FPGAs!
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- ARM unveils 64-bit v8 architecture at ARM TechCon 2011
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Author Archives: sleibson2
A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
Jack Ganssle has just published the latest edition of his Embedded Muse newsletter with a very informative, hands-on look at the ARM Cortex-M4 and –M0 processor cores in the NXP LPC4350. In particular, Jack looked at processing speed and power … Continue reading
Posted in ARM, Cortex-M0, Cortex-M4, System Realization
Tagged ARM architecture, ARM Cortex-M0, ARM Cortex-M4, Jack Ganssle, microcontroller, Multi-core processor, SIMD
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Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
(You do not know how hard it was to write that headline.) Let’s say you need a really small exploration vehicle to check out the ruins of a natural disaster to search for survivors. Nature has been at this design … Continue reading
Friday Video: A different kind of fab with some very, very cool machines
Semiconductors are not the only things made in fabs.
Posted in EDA360
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Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
Dave Jones down in Australia (not Austria!) is attending the Australian Electronex show in Sydney and he’s posted a long video where representatives from the IPC Designers Council discuss the relatively new IPC-2581 standard for describing printed circuit boards and … Continue reading
Posted in EDA360, pcb, System Realization
Tagged Dave Jones, OrCAD, Printed circuit board
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Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
Rick Merritt has just published an interesting article in EETimes: the PCI Special Interest Group (PCI SIG) expects to announce an adaptation of the ever-popular PCIe interface for mobile devices including smartphones. Merritt reports that the PCI SIG and MIPI … Continue reading
Posted in EDA360, IP, Mobile, SoC Realization, System Realization
Tagged MIPI Alliance, PCI Express, PCI SIG, PHY
2 Comments
3D Thursday: Hella big conference on multi-die integration in the heart of Silicon Valley
There’s a strange little high-rise hotel called the Biltmore in the center of Silicon Valley at the intersection of the Montague Expressway and Highway 101. It’s going to be the site of this year’s “Roadmaps for Multi Die Integration” conference … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization
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Would you like a guide to several new microcontrollers based on the ARM Cortex-M series of processor cores?
Alban Rampon has just published a guide to many new developments surrounding the ARM Cortex-M series of microcontroller cores. The guide includes a discussion of Freescale Kinetis L microcontrollers based on the ARM Cortex-M0+ core; discussions of microcontrollers based on … Continue reading
Jim Hogan wants to give you the secrets of raising funds for an EDA startup. Free!
On October 17, Jim Hogan’s second “conversation” in his Emerging Companies Series will deal with a key topic for EDA entrepreneurs: “How to Raise Money and How Not to Spend It.” Hogan’s guests include Amit Gupta, President and CEO of … Continue reading
Posted in EDA360
Tagged Angel investor, Business, EDA, Entrepreneur, Hogan, Jim Hogan
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Free Webinar on using Freescale Kinetis L series microcontrollers based on ARM Cortex-M0+ core. September 12. Hurry!
You have a little more than a day to register for the free Freescale Webinar on using the company’s Kinetis L microcontrollers based on the relatively new ARM Cortex-M0+ processor core. These are relatively new microcontrollers, just rolling out now, … Continue reading
Posted in ARM, Cortex-M0, EDA360, System Realization
Tagged ARM Cortex-M0, Cortex-M0, Freescale Semiconductor
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Friday Video: Dating with augmented reality in the near future
Here’s a short film about augmented reality in the near future by Eran May-raz and Daniel Lazo. This is their graduation project from Bezaleal academy of arts. Scary, depressing, or cool? I guess the answer depends on your demographic.
Great Googlie Mooglies! Kickstarter funds Arduino work-alike based on Freescale Kinetis K microcontroller (ARM Cortex-M4)
Kickstarter, a funding force of nature in the cyberscape, is funding the small-scale production of an Arduino-like development board based on a Freescale Kinetis K microcontroller (ARM Cortex-M4 processor core inside). More than 500 backers have pledged nearly $23,000 $31,000 … Continue reading
Posted in EDA360, System Realization
Tagged Arduino, ARM Cortex-M4, Freescale Semiconductor, Kickstarter, microcontroller
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3D Thursday: Produce cost-effective 2.5D and 3D devices. Attend the Known Good Die conference, November 15
Robert Patti, Chief Technical Officer and VP of Design Engineering at Tezzaron Semiconductor is the just-announced speaker at the Known Good Die conference being held on November 15 in Santa Clara, CA. His topic: Using Repair & Redundancy with KGD … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization
Tagged 2.5D, Supply chain, Tezzaron Semiconductor, Through-silicon via
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Where do semiconductor foundries come from?
Have you ever wondered how we got from a world solely occupied by semiconductor vendors with their own fabs to today’s hodgepodge of IDMs (independent device manufacturers, the new name for the old-style “semiconductor vendor”), fab-lite vendors, and fables vendors? … Continue reading
TI Stellaris LaunchPad eval board features ARM Cortex-M4F. Intro price: $4.99. Get yours now.
Texas Instruments’ Stellaris LM4F120H5QRC microcontroller is based on an 80MHz copy of the ARM Cortex-M4F processor core with an integrated single-precision floating-point unit. It also includes 256Kbytes of Flash memory, 32Kbytes of SRAM, 2Kbytes of EEPROM, and a host … Continue reading
Posted in ARM, Cortex-M4, EDA360, SoC Realization, Texas instruments
Tagged ARM Cortex-M4F, microcontroller, Stellaris LaunchPad, Texas Instruments, USB
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Friday Video: Quadcopter version of flying aircraft carrier from Avengers movie
One of the silliest high-concept ideas in the Avengers movie has to be the flying aircraft carrier operated by super-secret agency S.H.I.E.L.D. Well, it’s from the comic books, right? Then why does it come as no surprise that someone has … Continue reading
Posted in EDA360
Tagged Avengers, Comic book, Helicarrier, Quadrotor, Russia, S.H.I.E.L.D., Scale model
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Samsung extends Android Galaxy to a credible point-and-shoot camera
You can now add Samsung to a small-but-growing list of digital camera vendors offering Android-based point-and-shoot cameras. The first was Nikon, announcing the S800c camera last week. (See “Nikon announces Android-powered camera: the $349 Coolpix S800c”) Now Samsung has introduced … Continue reading
Posted in Android, EDA360, System Realization
Tagged Android, Jelly bean, Nikon, Nikon Coolpix series, Point-and-shoot camera, Samsung, Samsung Galaxy Camera, Wi-Fi
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Daniel Payne reviews new Mixed-Signal Methodology book. He enjoyed it. Discount ends tomorrow!
SemiWiki blogger and EDA Consultant Daniel Payne has just published a second, more extensive review of the new Mixed-Signal Methodology book just published by Cadence. He has included extensive technical information from the book in his review, so if you’re … Continue reading
Posted in EDA360, Mixed Signal
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3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization
Tagged eMMC, Intel, Intel Atom, LPDDR2, Medfield, mobile phone, SDRAM, SoC
7 Comments
Zowie! More than 50 x86 cores on the Intel Knights Corner Manycore Coprocessor
Today at the Hot Chips 24 conference, George Chrysos discussed the Intel MIC (Many Integrated Core) architecture of the Knights Bridge chip, to be formally called the Intel Xeon Phi coprocessor. This chip runs Linux, but it’s designed to act … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged GDDR5, Intel, Knights Bridge, Manycore, Phi, Xeon
2 Comments
Paul McLellan on 20nm design
EDA analyst and SemiWiki writer Paul McLellan published an article on 20nm design last week. It’s based on the Cadence White Paper on the same topic. You can see Paul’s article here. The Cadence 20nm White Paper is here.
Posted in 20nm, EDA360, Silicon Realization
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Ode to Neil Armstrong (1930-2012), in his own words
“I am, and ever will be, a white-socks, pocket-protector, nerdy engineer and I take a substantial amount of pride in the accomplishments of my profession.” Neil Armstrong, first person to step on the Earth’s moon, Apollo 11. Godspeed, Neil.
Friday Video: Buy the guts of a GoPro 1080p video camera for $159.95 from Sparkfun Electronics
Sparkfun Electronics in Boulder, Colorado runs a new-product video every Friday. Today, the video features a board-level product called a HackHD, which is essentially the electronic guts of a $199.99 GoPro rugged camcorder. The HackHD sells for $159.95. As usual, … Continue reading
Posted in EDA360
Tagged 1080p, Boulder Colorado, GoPro, Sparkfun, video, Video camera
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Friday Video: Eyeing the eye of 5Gbps USB 3.0 signals with a 13GHz digital scope
Before he has to return his 13GHz, 40Gsamples/sec Agilent 90000 series loaner scope (Digital Signal Analyzer) and its equally pricey test probes, Dave Jones uses it to check out the 5Gbps USB 3.0 signaling and signal integrity in a new … Continue reading
Friday Video: WiFi donkeys augment reality in history village
The “Village of Yore” in the town of Hoshaya, Israel has augmented its live donkey ride through its historic village with WiFi communications so that tourists can snap photos and immediately upload them. They can tweet, post on Facebook, etc, … Continue reading
Posted in EDA360
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